Open Access
ARTICLE
HOT WATER COOLED HEAT SINKS FOR EFFICIENT DATA CENTER COOLING: TOWARDS ELECTRONIC COOLING WITH HIGH EXERGETIC UTILITY
Peter Kastena, Severin Zimmermanna, Manish K. Tiwaria, Bruno Michelb, Dimos Poulikakosa,*
a
Laboratory of Thermodynamics in Emerging Technologies, ETH Zurich, 8092 Zurich, Switzerland
b Advanced Thermal Packaging, IBM Zurich Research Laboratory, 8803 Rueschlikon, Switzerland
* Corresponding Author: Email: , Ph.: +41 44 632 2738, Fax: +41 44 632 11 76
Frontiers in Heat and Mass Transfer 2010, 1(2), 1-10. https://doi.org/10.5098/hmt.v1.2.3006
Abstract
Electronic data center cooling using hot water is proposed for high system exergetic utility. The proof-of-principle is provided by numerically
modeling a manifold micro-channel heat sink for cooling microprocessors of a data center. An easily achievable 0.5l/min per chip water flow, with
60°C inlet water temperature, is found sufficient to address the typical data center thermal loads. A maximum temperature difference of ~8°C was
found between the solid and liquid, confirming small exergetic destruction due to heat transport across a temperature differential. The high water
outlet temperature from the heat sink opens the possibility of waste heat recovery applications.
Keywords
Cite This Article
Kasten, P., Zimmermann, S., Tiwari, M. K., Michel, B., Poulikakos, D. (2010). HOT WATER COOLED HEAT SINKS FOR EFFICIENT DATA CENTER COOLING: TOWARDS ELECTRONIC COOLING WITH HIGH EXERGETIC UTILITY.
Frontiers in Heat and Mass Transfer, 1(2), 1–10.