Heat conduction
From Thermal-FluidsPedia
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*<B>[[Steady State Heat Conduction]]</B> | *<B>[[Steady State Heat Conduction]]</B> | ||
- | :[[ | + | :[[Finite slabs]], [[cylindrical]] and [[spherical]] walls, [[extended surface]], [[bioheat equation]], [[two-dimensional conduction]], [[conduction from burried object]] |
*<B>[[Unsteady tate Heat Conduction]]</B> | *<B>[[Unsteady tate Heat Conduction]]</B> | ||
:[[Lumped analysis]], one-dimensional transient conduction in [[finite slabs]], [[cylinders]], [[spheres]], [[semi-infinite body]], and [[multi-dimensional conduction]]. | :[[Lumped analysis]], one-dimensional transient conduction in [[finite slabs]], [[cylinders]], [[spheres]], [[semi-infinite body]], and [[multi-dimensional conduction]]. |
Revision as of 21:37, 8 April 2009
Conduction is heat transfer across a stationary medium, either solid or fluid. For an electrically nonconducting solid, conduction is attributed to atomic activity in the form of lattice vibration, while the mechanism of conduction in an electrically-conducting solid is a combination of lattice vibration and translational motion of electrons. Heat conduction in a liquid or gas is due to the random motion and interaction of the molecules. For most engineering problems, it is impractical and unnecessary to track the motion of individual molecules and electrons, which may instead be described using the macroscopic averaged temperature.
- Fundamentals of Heat Conduction
- Finite slabs, cylindrical and spherical walls, extended surface, bioheat equation, two-dimensional conduction, conduction from burried object
- Lumped analysis, one-dimensional transient conduction in finite slabs, cylinders, spheres, semi-infinite body, and multi-dimensional conduction.
- Numerical Solution
- Discretization of computational domain and governing equations, one-dimensional steady and unsteady state conduction, multi-dimensional unsteady-state conduction, and solution of algebraic equations
- Melting and Solidification
- Classification of solid-liquid phase change problem, boundary conditions at interface, exact solution,and numerical solution.
- Microscale heat conduction